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product structure : silicon monolithic integrated circuit this product has no designed protection against radioactive ra ys . 1/ 25 tsz02201-0m1m0fz15130-1-2 ? 2015 rohm co., ltd. all rights reserved. 24.mar.2016 rev.003 tsz22111 ? 14 ? 001 www.rohm.com pressure sensor series pressure sensor ic BM1383AGLV general description BM1383AGLV is piezo-resistive pressure sensor. BM1383AGLV does temperature compensation for mems inside chip, so its very easy to get pressure information. features ? piezo-resistive pressure sensor. ? pressure range is from 300hpa to 1100hpa. ? built-in temperature compensation function. ? i 2 c interface. ? small package. applications ? smartphone, healthcare, mobile device (e.g. game). key specifications ? pressure range: 300hpa to 1100hpa ? relative pressure accuracy: 0.12hpa(typ) ? absolute pressure accuracy: 1hpa(typ) ? average current consumption: 3 a (typ) ? operating temperature range: - 40 c to +85c package w(typ) x d(typ) x h(max) clga12v025m 2.50mm x 2.50mm x 1.00 mm typical application circuit adc temperature sensor m ux s ignal processing i 2 c scl sda nc1 nc0 drdy pressure sensor memory clock tout test1 test0 tin vdd vss dreg host BM1383AGLV regulator (internal) datashee t downloaded from: http:///
2/ 25 tsz02201-0m1m0fz15130-1-2 ? 2015 rohm co., ltd. all rights reserved. 24.mar.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 BM1383AGLV contents general description ........................................................................................................................................................................ 1 features .......................................................................................................................................................................................... 1 applications .................................................................................................................................................................................... 1 key specifications ........................................................................................................................................................................... 1 package .......................................................................................................................................................................................... 1 typical application circuit ............................................................................................................................................................... 1 pin configuration ............................................................................................................................................................................ 3 pin description ................................................................................................................................................................................ 3 block diagram ................................................................................................................................................................................ 4 absolute maximum ratings ............................................................................................................................................................ 5 thermal resistance ........................................................................................................................................................................ 5 recommended operating conditions ............................................................................................................................................. 5 electrical characteristics ................................................................................................................................................................ . 6 i 2 c bus timing chart ....................................................................................................................................................................... 7 register map .................................................................................................................................................................................. 8 i 2 c bus communication ................................................................................................................................................................ . 13 interrupt function ........................................................................................................................................................................... 14 control sequence .......................................................................................................................................................................... 15 application example ..................................................................................................................................................................... 19 i/o equivalent circuit ..................................................................................................................................................................... 20 operational notes ......................................................................................................................................................................... 21 ordering information ..................................................................................................................................................................... 23 marking diagrams ......................................................................................................................................................................... 23 physical dimension, tape and reel information ........................................................................................................................... 24 revision history ............................................................................................................................................................................ 25 downloaded from: http:///
3/ 25 tsz02201-0m1m0fz15130-1-2 ? 2015 rohm co., ltd. all rights reserved. 24.mar.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 BM1383AGLV pin configuration pin description pin no. pin name in/out function 1 dreg - logic voltage pin (note 1) 2 vdd - power voltage pin (note 2) 3 vss - gnd pin 4 t in in test pin (connect to tout) 5 tout out test pin (connect to tin) 6 test1 in test pin (connect to gnd) 7 nc0 - non connect pin 8 nc1 - non connect pin 9 scl in i 2 c serial bus clock pin 10 sda in/out i 2 c serial bus data pin 11 drdy out data ready output pin 12 test0 in test pin (connect to gnd) (note 1) please place a bypass capacitor between dreg and v ss in the proximity of the terminals. please set a bypass capacitor of 0.22f between dreg and vss. please do not use this pin for external power source. (note 2) please place a bypass capacitor between vdd and vss in the proximity of the terminals. top view bottom view (pads not visible) (pads visible) 7 nc0 8 nc1 9 scl 10 sda 11 drdy 12 test0 1 dreg 2 vdd 3 vss 4 tin 5 tout 6 test1 hole 7 nc0 8 nc1 6 test1 12 test0 1 dreg 2 vdd 9 scl 10 sda 11 drdy 3 vss 4 tin 5 tout 1pin mark downloaded from: http:///
4/ 25 tsz02201-0m1m0fz15130-1-2 ? 2015 rohm co., ltd. all rights reserved. 24.mar.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 BM1383AGLV block diagram adc temperature sensor m ux s ignal processing i 2 c scl sda nc1 nc0 drdy pressure sensor memory clock tout test1 test0 tin vdd vss dreg BM1383AGLV regulator (internal) downloaded from: http:///
5/ 25 tsz02201-0m1m0fz15130-1-2 ? 2015 rohm co., ltd. all rights reserved. 24.mar.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 BM1383AGLV absolute maximum ratings (ta = 25c) parameter symbol rating unit power supply v dd_mr 4.5 v input voltage v in -0.3 to vdd+0.3 v operating temperature t opr -40 to +85 c storage temperature t stg - 40 to +125 c maximum junction temperature t jmax 125 pressure p ov r 20000 hpa caution: operating the ic over the absolute maximum ratings may damage t he ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. thermal resistance ( note 1) parameter symbol thermal resistance (typ) unit 1s (note 3) 2s2p ( note 4) clga12v025m junction to ambient ja 360.5 230.5 c /w junction to top characterization parameter (note 2) jt 153 144 c /w (note 1) based on jesd 51 -2a(still-air) (note 2) the thermal characterization parameter to report the differe nce between junction temperature and the temperature at the top center of the outside surface of the component package. (note 3) using a pcb board based on jesd 51 - 3. layer number of measurement board material board size single fr -4 114.3mm x 76.2mm x 1.57mmt top copper pattern thickness footprints and traces 70 m (note 4) using a pcb board based on jesd 51 - 7. layer number of measurement board material board size 4 layers fr -4 114.3mm x 76.2mm x 1.6mmt top 2 internal layers bottom copper pattern thickness copper pattern thickness copper pattern thickness footprints and traces 70 m 74.2mm x 74.2mm 35 m 74.2mm x 74.2mm 70 m recommended operating conditions (ta= - 40 c to +85 c ) parameter symbol rating unit power supply vdd 1.7 to 3.6 v i 2 c clock input frequency f scl max 400 khz downloaded from: http:///
6/ 25 tsz02201-0m1m0fz15130-1-2 ? 2015 rohm co., ltd. all rights reserved. 24.mar.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 BM1383AGLV electrical characteristics (unless otherwise specified vdd =1 .8 v ta=25c) parameter symbol min typ max unit conditions current consumption operating mode current consumption i ddp - 650 1000 a power down mode current i ss - 1 5 a pwr_down=0 , rstb =0 logic l input voltage v il gnd - 0.3 * vdd v sda, scl h input voltage v ih 0.7 * vdd - vdd v sda, scl l input current i il - 10 - 0 a v il = gnd (sda, scl) h input current i ih 0 - 10 a v ih = vdd (sda, scl) l output voltage 1 v ol1 gnd - 0.2 * vdd v il= -0.3ma ( drdy ) l output voltage 2 v ol2 gnd - 0.2 * vdd v il= -3ma (sda) pressure characteristics pressure detection range p r 300 - 11 00 hpa relative pressure accuracy (note 1) p rel - 0.12 - hpa 950hpa to 1050hpa absolute pressure accuracy p abs - 1 - hpa 1000hpa temperature accuracy t abs - 2 - c 25 c to 85 c measurement time t m - - 6 ms ave_num=000 (note 1) target values me as urement time is changed by average number of measurement data. it is written in measurement time. downloaded from: http:///
7/ 25 tsz02201-0m1m0fz15130-1-2 ? 2015 rohm co., ltd. all rights reserved. 24.mar.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 BM1383AGLV i 2 c bus timing chart (unless otherwise vdd=1.8v ta=25c) parameter symbol min typ max unit conditions i 2 c scl frequency f scl 0 - 400 khz i 2 c l period of scl t low 1.3 - - s i 2 c h period of scl t high 0.6 - - s i 2 c setup time for start condition t su;sta 0.6 - - s i 2 c hold time for (repeated) start condition t hd;sta 0.6 - - s i 2 c data setup time t su;dat 100 - - ns i 2 c data hold time t hd;dat 0 - - s i 2 c setup time for stop condition t su;sto 0.6 - - s i 2 c bus free time between stop and start condition t buf 1.3 - - s sda scl t hd;sta t low t hd;dat t su;dat t high t su;sta t hd;sta t su;sto t buf downloaded from: http:///
8/ 25 tsz02201-0m1m0fz15130-1-2 ? 2015 rohm co., ltd. all rights reserved. 24.mar.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 BM1383AGLV register map (n ote 1) address register name rw d7 d6 d5 d4 d3 d2 d1 d0 0f h id 1 r 1 1 1 0 0 0 0 0 10h id 2 r 0 0 1 1 0 0 1 0 12h power_down rw 0 0 0 0 0 0 0 pwr_ down 13h r eset rw 0 0 0 0 0 0 0 rstb 14h mode_control rw ave_num dren 1 0 mode 19h status r 0 0 0 0 0 0 0 rd_ drdy 1ah pressure_msb (upper 8bit) r press_out[15:8] 1bh pressure_lsb (lower 8bit) r press_out[7:0] 1ch pressure_lsb (least 6bit) r press_out_xl[5:0] 0 0 1dh temperature_msb (upper 8bit) r temp_out[15:8] 1eh temperature_l sb (lower 8bit) r temp_out[7:0] (n ote 1) do not write any commands to other addresses except above. do not write 1 to the fields in which value is 0 in above table. address from 0x14 to 0x1e registers can be accessed only when pw r_down=1 and rstb=1. (in other case write: ignored, read: 0xxx) downloaded from: http:///
9/ 25 tsz02201-0m1m0fz15130-1-2 ? 2015 rohm co., ltd. all rights reserved. 24.mar.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 BM1383AGLV id1(0f h) field bit type description id1 7 : 0 r 11100000 default value e0h id 2(10h) field bit type description id2 7 : 0 r 00110010 default value 32h power_down(12h) field bit type description reserved 7 : 1 rw reserved write 0 pwr_down 0 rw 0: power down 1: active default value 00h reset(13h) field bit type description reserved 7 : 1 rw reserved write 0 rstb 0 rw 0: measurement control block is reset 1: measurement control block is active default value 00h downloaded from: http:///
10 / 25 tsz02201-0m1m0fz15130-1-2 ? 2015 rohm co., ltd. all rights reserved. 24.mar.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 BM1383AGLV mode_control(14h) field bit type description ave_num 7 : 5 rw set the average number of measurement data 000: single 001: average of 2 times 010: average of 4 times 011: average of 8 times 100: average of 16 times 101: average of 32 times 110: average of 64 times 11 1 : inhi bit dren 4 rw drdy pin enable 0 : drdy pin disable 1 : drdy pin enable reserved 3 rw refer to operation mode transition reserved 2 rw reserved write 0 mode 1 : 0 rw set measurement mode default value 08h measurement time and rms noise against number of average ave_num measurement time t m max[ms] measurement cycle t i max[ms] rms noise [hpa] 0 00 6 60 0.090 001 9 60 0.063 010 16 60 0.045 011 30 60 0.032 100 60 60 0.023 101 120 12 0 0.016 110 240 24 0 0.011 rms noise is calculated as standard deviation of 32 data points (1 ). rms noise is a reference value and it s not the value with guarantee. condition vdd =1 .8 v ta=25c measurement mode mode measurement mode 00 stand by 01 one shot 10 continuous 11 prohibition pressure and temperature are measured at one rate measurement time one shot mode perform one measurement. measurement data is updated when measure ment is completed, so it should be read more than t m after start of measurement. continuous mode repeat measurement in every measurement cycle t i . the latest measurement data which is completed is read. measurement time t m and measurement cycle t i is determined by number of measurement. first measurement measurement time t m measurement cycle t i second measurement start of measurement measurement time t m start of measurement start of measurement measurement measurement pressure data of first time measurement is read. downloaded from: http:///
11 / 25 tsz02201-0m1m0fz15130-1-2 ? 2015 rohm co., ltd. all rights reserved. 24.mar.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 BM1383AGLV operation mode transition please refer to the below figure of operation mode transition. power down mode is the smallest current consumption mode du e to circuit is off. please set this mode when reducing current consumption. measurement is not available in this mode, so the measurement is performed after switching to standby mode. in reset mode, regulator for internal blocks is active and m easurement control block is reset. register is initialized in reset mode. measurement command is acceptable when 1 is written in rstb there are 2 measurement modes. one shot mode and continuo us mode. they are transferred from stand by mode. then, please set ave_num register at the same time. please write 0x1400 when transferring to standby mode again. in one shot mode, a single measurement is performed when 01 is written in mode . after the measurement completes, it is transferred to standby mode automatically. w hen 0x1400 is written before end of measurement, mode is switched to standby immediately but pressure value is no t updated. transition to the other measurement mode during measurement i n one shot mode is forbidden. in continuous mode, when 10 is written in mode , measurement starts and it continues until 0x1400 is written.transition to the other measurement mode from continuous mode is forbidden. 0x14x9 measurement time tm later or 0x1400 0x14xa 0x1400 one shot continuous stand by reset 0x1301 0x1300 power down 0x1201 0x1200 0x1400 0x14xa prohibition prohibition regulator off processing off regulator on processing off regulator on processing on 0x14x9 prohibition 0x yyzz send command yy address zz data downloaded from: http:///
12 / 25 tsz02201-0m1m0fz15130-1-2 ? 2015 rohm co., ltd. all rights reserved. 24.mar.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 BM1383AGLV status(19h) field b it type description reserved 7 : 1 r 0000000 rd_drdy 0 r pressure and temperature measurement data ready bit 0: measurement data output is not yet available (measuring ) 1: measurement data output is available default value 00h pressure_msb(1ah) field bit type description press_out[15:8] 7 : 0 r the upper part of pressure data default value 00h pressure_lsb(1bh) field bit type description press_out[7:0] 7 : 0 r the lower part of pressure data default value 00h pressure_lsb(least 6bit) ( 1ch ) field bit type description press_out_xl [5:0] 7 : 2 r pressure data output (decimal extension 6bit) reserved 1 : 0 r 00 default value 00h conversion to pressure value is like below. pressure counts = press_out[15:8] x 2 14 + press_out[7:0] x 2 6 + press_out_xl[5:0] [counts] (dec) pressure value [hpa] = pressure counts [counts] / 2048 [counts/hp a] data register (0x1a~0x1c) should be read by continuous read. data is updated at the timing of measurement completion. if they are not read by continuous read, data might be mixed up with the data of dif ferent measurement. temperature_msb(1d h) field bit type description temp_out[15:8] 7 : 0 r the upper part of temperature data. default value 00h temperature_lsb(1e h) field bit type description temp_out[7:0] 7 : 0 r the lower part of temperature data default value 00h conversion to temperature value is like below. but please note that temp_out is data with sign (two s complement). temp counts = temp_out[15:8] x 2 8 +temp_out[7:0] [counts] (dec) temperature value [ ] = temp counts [counts] / 32 [counts/ ] (in case of positive number) data register (0x1d,0x1e) should be read by continuous read. data is updated at the timing of measurement completion. if they are not read by continuous read, data might be mixed up w ith the data of different measurement. downloaded from: http:///
13 / 25 tsz02201-0m1m0fz15130-1-2 ? 2015 rohm co., ltd. all rights reserved. 24.mar.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 BM1383AGLV i 2 c bus communication 1. slave address : 1011101 2. write format (1) case of indicating only register address st slave address w 0 ack indicate register address ack sp (2) case of writing data register after indicating register address st slave address w 0 ack indicate register address ack data specified at register address field ack ?????? ack data specified at register address field + n ack sp 3. read format (1) case of continuous reading data after indicating register addres s (master issues restart condition) st slave address w 0 ack indicate register address ack st slave address r 1 ack data specified at register address field ack data specified at register address field + 1 ack ?????? ack data specified at register address field + n nack sp (2) case of continuous reading data st slave address r 1 ack data specified at register address field ack data specified at register address field + 1 ack ?????? ack data specified at register address field + n nack sp from master to slave from slave to master downloaded from: http:///
14 / 25 tsz02201-0m1m0fz15130-1-2 ? 2015 rohm co., ltd. all rights reserved. 24.mar.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 BM1383AGLV interrupt function in case that interrupt function is enable (dren=1), interrupt occ ur (rd_drdy register become 1 and drdy terminal become l active) just after measurement is finished. once interrupt occur, rd_drdy register and drdy terminal keep acti ve until interrupt is clear ed . interrupt can be cleared by reading rd_drdy register or setting reset mode. drdy terminal is nch open drain so this terminal should be pull- up to voltage source by an external resister. drdy terminal is high impedance just after vdd is supplied. drdy terminal becomes inactive (high impedance) by reading rd_drdy register or setting reset mode. vdd current (approximately 6a at vdd=1.8v) is consumed during drdy is active . if you disable interrupt function, please set dren=0 after clearing interrupt. drdy pin action example 1shot mode stand by one shot high low drdy pin write 0x14x9 stand by data ready ok read 0x19 one shot stand by one shot stand by read 0x19 write 0x14x9 write 0x14x9 operation mode data ready ok data ready ok downloaded from: http:///
15 / 25 tsz02201-0m1m0fz15130-1-2 ? 2015 rohm co., ltd. all rights reserved. 24.mar.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 BM1383AGLV control sequence 1. power supply start-up sequence please do the command control by i 2 c after power is supplied. 2. power supply end sequence > 2 ms vdd i2c command write 0x1201 > 0 .1 ms command write 0x1301 comma nd 1.7v command write 0x1200 command write 0x1300 > 0ms > 0 ms vdd i2c 1.7v 0.4v > 1 ms downloaded from: http:///
16 / 25 tsz02201-0m1m0fz15130-1-2 ? 2015 rohm co., ltd. all rights reserved. 24.mar.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 BM1383AGLV 3. starting sequence power supply power_down setting write 0x1201 reset setting write 0x1301 completion of starting sequence release power down release reset mode wait for more than 2ms wait for more than 0.1ms 4. measurement sequence: one shot mode starting sequence mode_control setting write 0x14 x9 (dren=1) drdy terminal l h read pressure read 0x 1a 0x 1c measurement complestion measurement mode setting wait interrupt( drdy ='l') or measurement end read pressure data enable drdy no yes mode_control setting write 0x14 x9 (dren=0) wait for the end of measurement no yes read status read 0x19 check interrupt status drdy terminal is set to 'h' by reading. downloaded from: http:///
17 / 25 tsz02201-0m1m0fz15130-1-2 ? 2015 rohm co., ltd. all rights reserved. 24.mar.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 BM1383AGLV 5 . measurement sequence: continuous mode starting sequence mode_control setting write 0x14xa (dren=1) drdy terminal l h read pressure read 0x 1a 0x 1c measurement complestion measurement mode setting wait interrupt( drdy ='l') or measurement end read pressure data enable drdy no yes mode_control setting write 0x14xa (dren=0) wait for the end of measurement no yes read status read 0x19 mode_control setting write 0x1400 shift to stand-by mode. yes no measurement stop enable int no yes end judgement of continuous mode check interrupt status drdy terminal is set to 'h' by reading. downloaded from: http:///
18 / 25 tsz02201-0m1m0fz15130-1-2 ? 2015 rohm co., ltd. all rights reserved. 24.mar.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 BM1383AGLV 6 . ending sequence measurement complestion reset setting write 0x1300 power_down setting write 0x1200 vdd off reset power down downloaded from: http:///
19 / 25 tsz02201-0m1m0fz15130-1-2 ? 2015 rohm co., ltd. all rights reserved. 24.mar.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 BM1383AGLV application example adc temperature sensor m ux s ignal processing i 2 c scl sda nc1 nc0 drdy pressure sensor memory clock tout test1 test0 tin vdd vss dreg BM1383AGLV regulator (internal) 0.22f 0.1f downloaded from: http:///
20 / 25 tsz02201-0m1m0fz15130-1-2 ? 2015 rohm co., ltd. all rights reserved. 24.mar.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 BM1383AGLV i/o equivalent circuit pin name equivalent circuit d iagr am pin name equivalent circuit diagram scl sda drdy dreg tout tin test0 test1 vdd vdd vdd vdd vdd downloaded from: http:///
21 / 25 tsz02201-0m1m0fz15130-1-2 ? 2015 rohm co., ltd. all rights reserved. 24.mar.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 BM1383AGLV operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an extern al diode between the power supply and the ic s power supply pin s. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. furthermore, connect a capacitor to ground at all power supply pins . consider the effect of temperature and aging on the capacitanc e value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces , the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small- signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the maximum junction temperature ratin g be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. in cas e of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the maximum junction temperature rating. 6. recommended operating conditions these conditions represent a range within which the expe cted characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the condi tions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and de lays, especially if the ic has more than one power supply. therefore, give special consideration to power c oupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field ma y cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors completely after each p rocess or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mountin g the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin . inter-pin shorts could be due to many reasons such as me tal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins du ring assembly to name a few. 11. unused input pins input pins of an ic are often connected to the gate of a mos trans istor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the elec tric field from the outside can easily charge it. the sma ll charge acquired in this way is enough to produce a signi ficant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise spe cified, unused input pins should be connected to the power supply or ground line. downloaded from: http:///
22 / 25 tsz02201-0m1m0fz15130-1-2 ? 2015 rohm co., ltd. all rights reserved. 24.mar.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 BM1383AGLV operational notes C continued 12. regarding the input pin of the ic in the construction of this ic, p-n junctions are inevitabl y formed creating parasitic diodes or transistors. the operation of these parasitic elements can result in mutu al interference among circuits, operational faults, or physi cal damage. therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoid ed. furthermore, do not apply a voltage to the input pins when no power supply voltage is applied to the ic. even i f the power supply voltage is applied, make sure that th e input pins have voltages within the values specified in the e lectrical characteristics of this ic. 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias a nd others. 14. disturbance light in a device where a portion of silicon is exposed to lig ht such as in a wl -csp, ic characteristics may be affected due to photoelectric effect. for this reason, it is recommended to co me up with countermeasures that will prevent the chip from being exposed to light. downloaded from: http:///
23 / 25 tsz02201-0m1m0fz15130-1-2 ? 2015 rohm co., ltd. all rights reserved. 24.mar.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 BM1383AGLV ordering information b m 1 3 8 3 a g l v - z e 2 part number package glv : clga12v025m packaging and forming specification e2: embossed tape and reel marking diagrams m 1 3 8 1 pin mark lot number part number marking 3 a clga12v025m (top view downloaded from: http:///
24 / 25 tsz02201-0m1m0fz15130-1-2 ? 2015 rohm co., ltd. all rights reserved. 24.mar.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 BM1383AGLV physical dimension, tape and reel information package name clga12v025m downloaded from: http:///
25 / 25 tsz02201-0m1m0fz15130-1-2 ? 2015 rohm co., ltd. all rights reserved. 24.mar.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 BM1383AGLV revision history date revision changes 17 .nov.2015 001 new release 30 .mar.2016 002 p1 modify typical application circuit p3 modify pin description p4 modify block diagram p5 modify absolute maximum ratings p6 modify electrical characteristics p9 modify power_down and reset p10 modify mode_control p11 modify operation mode transition p12 modify status, pressure value and temperature value p13 modify i 2 c bus communication p1 9 modify application example 21.apr.2016 00 3 p5 modify absolute maximum ratings and thermal resistance p8,10,12 modify note of register map p11 modify operation mode transition p 21, 22 modify operational notes downloaded from: http:///
notice-p ga -e rev.003 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufactured for application in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely h igh reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear powe r controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in adv ance. unless otherwise agreed in writing by rohm in advance, rohm s hall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arisin g from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific appl ications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to stri ct quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequ ate safety measures including but not limited to fail-safe desig n against the physical injury, damage to any property, whic h a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified be low. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from th e use of any rohms products under any special or extraordinary environments or conditions. if yo u intend to use our products under any special or extraordinary environments or conditions (as exemplified belo w), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be n ecessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are e xposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed t o static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing component s, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mou nted products in using the products. 6 . in particular, if a transient load (a large amount of load appl ied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mou nting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affec t product performance and reliability. 7 . de -rate power dissipation depending on ambient temperature. wh en used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range desc ribed in the product specification. 9 . rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc .) flux is used, the residue of flux may negatively affect prod uct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mus t be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts , please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
notice-p ga -e rev.003 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, p lease allow a sufficient margin considering variations o f the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and a ssociated data and information contained in this docum ent are presented only as guidance for products use. therefore, i n case you use such information, you are solely responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take pr oper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate i f the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderabil ity of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indi cated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a c arton. 4. use products within the specified time after opening a humi dity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label a two-dimensional barcode printed on rohm products label is f or rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to appl ication example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, a ctions or demands arising from the combination of the products with other articles such as components, circuits, systems or ex ternal equipment (including software). 3. no license, expressly or implied, is granted hereby under any inte llectual property rights or other rights of rohm or any third parties with respect to the products or the information contai ned in this document. provided, however, that rohm will not assert it s intellectual property rights or other rights against you or you r customers to the extent necessary to manufacture or sell products containing the products, subject to th e terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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